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  • Revision:2018 Edition, August 2018
  • Published Date:August 2018
  • Status:Active, Most Current
  • Document Language:English
  • Published By:Association Connecting Electronics Industries (IPC)
  • Page Count:28
  • ANSI Approved:No
  • DoD Adopted:No

  • The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take full advantage of this phenomenon, it is necessary to understand the conditions under which such coverage can be assured. A round robin study has been performed by IPC/ PERM Task group 8-81, during which identical sets of test vehicles were assembled, in accordance with IPC J-STD-001, Class 3, at multiple locations. All of the test vehicles were analyzed to determine the extent of complete tin dissolution on a variety of component types. Results of this study are presented together with relevant conclusions and recommendations to guide high reliability end-users on the applicability and limitations of this mitigation strategy.